CEM Services - UK Made - Complex Capability 

Solder jet paste printing, for high yield SMT production

In 2008, Gemini Tec were the first UK CEM to introduce 'Solder Jet Paste Printing' technology, providing its customers with unrivalled product quality in surface mount production.

Today, Gemini Tec is the only UK CEM operating with three world-class solder jet printing systems across its fleet of SMT placement lines, covering prototpe, NPI and full production.

MY600 Printer

With class leading technology we successfully place in excess of 80,000 BGA type devices per year, providing comprehensive manufacturing services for SMT and highly complex SMT products that use BGA, leadless, QFN and PoP device technology.

With over 80% of typical SMT production errors directly attributed to the use of stencils, solder jet printing delivers the technical solution for high yield and high reliability PCBA manufacturing for todays products.


How does solder jet paste printing work?

Jet printing is non-contact printing process that applies solder paste directly onto the PCB pad, without the need to use any stencil tooling.

Small solder paste deposits are placed at a rate of over 1 million dots per hour, to accurately construct the optimum solder paste typography for each and every pad position on the board. Such close control allows us to obtain the optimum reflow conditions first time, every time.

Jet printing removes the limitations of stencils. It delivers a new level of reliability for rigid and flexible substrates with board cavities, package-on-package, QFNs and new components with small process windows. 

By optimising the solder paste process we are able to remove the typical production errors, such as floating QFN devices, excessive and insufficient solder, that lead to poor yield, higher build costs and the inevitable time delays.

Thick thin stepped stencil ny 2 MY600 003



Our manufacturing process provides high levels of accuracy with consistent quality. Assured delivery times can be achieved without the constraints of using stencils. We are able to adopt a lean, fast and cost effective approach to SMT/PCB production, regardless of lead-time and complexity. 

Our investment into the worlds foremost process technology ensures our customers benefit from numerous technical and commercial advantages. 

Solder Paste Typography 001




Solder Jet Printing has many commercial & technical advantages for Gemini Tec and its customers.

  • 100% accurate repeatable, without deviation.
  • Optimum solder joints, typical yields at 100%.
  • No stencil tooling costs.
  • Process development in real time.
  • Lower manufacturing costs.
  • Shorter lead times and no risk of production delays.
  • Suitable for all SMT devices, BGA, PoP, QFN devices.
  • Optimised for 3D cavity printing and technical components
  • The only UK CEM operating with two solder jet paste printers.



‘Solder Jet Printing’ technology is used across our entire manufacturing process.

Supplied by Mycronic, our MY500, MY600 and MY700 jet printers are providing the optimal solder paste deposits to PCB assemblies at a rate equivalent to 100,000 CPH. Solder jet printing is fast and reliable, delivering higher levels product quality beyond the capability of stencils.

Download more information here: pdfG-TEC_CEM_Services.pdf2.59 MB


We no longer use or charge for stencils.

Close up view of our solder jet printer

Electronic tooling for jet printing is created directly from your ODB++ data or ASCII CAD data, removing the need to wait and verify the critical printing process and allowing production to commence immediately. Paste modifications can be made instantly within the production cycle, removing the risk of poor quality solder joints and time delays.

The generation of production tooling directly from your ODB++ data removes the risk of errors when creating data for SMT placement and automated optical inspection. Review our datasheet for our tooling requirements here: pdfG-Tec_Engineering_Data_Packs_Issue_1.pdf81.63 KB

Solder jet printing allows us to manufacture all SMT products to a higher level of product quality and consistently. If you are looking to build surface mount products with SMT devices, such as BGA, PoP, QFNs or any hard to mount device, contact us for to talk over the technical advantages that we provide.

You can even arrange a visit for a full technical demonstration. Tel +44 (0) 1252 333 444.



What our customers say about solder jet printing:

"DSL have found the solder jet printing technology used at Gemini has vastly improved the yields for our high complexity PCB products, together with savings in NRE charges and improved delivery times."