CEM Services - UK Made - Complex Capability 

Vapor Phase Reflow for complex SMT boards

Gemini Tec use the latest processing technology available to manufacture customer PCBA products. Vapor phase reflow is used in conjunction with vacuum processing capability for void free soldering on complex PCB assemblies. 


Vapor Phase Soldering is the best method to achieve the optimum soldering quality.

Also known as condensation soldering. A chemically inert fluid is used for the heat transfer, the Galden fluid is a non-corrosive and electrically non-conductive and allows a maximum temperature to be set during relfow.

When the fluid starts to evaporate, a layer vapor and condensing fluid covers the PCBA creating an inert and oxygen-free atmosphere. The vapor’s weight is greater than the surrounding air and forms a protective gas atmosphere and as soon as the PCBA is immersed into the vapor zone, the vapor condenses on the PCBA and transfers the heat. As the heat transfer is linear across the entire assembly, the PCBA does not overheat. Irrespective of the time the PCBA is within vapor, the temperature can never exceed the maximum vapor temperature.

As a result, the solder process can be reliably reproduced and delivers a repeatable process. The vapor phase soldering process achieves perfect results on a wide range of assemblies, from flexible to multi-layer substrates, reliably without overheating.

Reference site: https://www.asscon.de/e/index.html

Advanced Capability with Vacuum Processing Technology:

In the multi-vacuum soldering process, assemblies are subjected to several vacuum applications with the option of applying vacuum processes both before and during the melting of the solder paste. Applying vacuum processes before the liquidous temperature is reached is particularly useful for removing any voids encapsulated and caused by printing or pick & place processes.

With lead free solders void formation risk is higher, due to the higher process temperatures. The patented technology used on ASSCON vapor phase removes voids (formed after soldering) from the liquid soldering location.

Automatic Solder Break (ASB)
During the soldering process, the solder melting is recognised by an automatic recognition of the melting point which avoids effectively the formation of cold soldering locations. The usual engineering of soldering profiles is removed allowing us to produce complex products, with reduced lead times on fast delivery prototypes.

0.25 mm BGA Vapour Phased


A typical complex PCB assembly produced at Gemini Tec using 0.4 mm pitch/12 mm sq. device: The process used to build this product combines the use solder jet printing, for the application of the solder deposit onto its 0.23 mm pads, placement of device using our Mycronic SX200 chip placement SMT line, followed by vapor phase reflow. Our jet printing capability includes AOI [inspection] of all the deposits, prior to placement, with vapour phase reflow ensuring the PCBA is subjected to correct thermal heat, avoiding interconnection problems, such as short and opens. Vacuum processing capability allows the balls to be free of voids.

Gemini Tec support a wide range of customers and applications from prototype to medium volume production, our investment in processing technology, allows us to support complex and demanding PCBA products where reliability and conformance is essential.

Contact us to talk about your requirements in more detail. +44 (0) 1252 333 444



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