Vapour Phase Reflow for complex SMT boards
Gemini Tec use the latest processing technology available to manufacture customer PCBA products. Vapour phase reflow is used in conjuncion with vacuum processing capability for void free soldering on complex PCB assemblies.
Vapor Phase Soldering, is also well known as condensation soldering. It uses the phase change of the heat transfer medium from gas-like to liquid state, to soak the PCB in preperation for relfow. This phase condensation submerses the PCBA until the correct temperature has been reached across the assembly, and with the high vapor density and the liquid film, the complete heating-up process takes place at an oxygen free environment. The heat transfer is linear across the enitre assembly, ensureing thermal reflow without overheating the assembly.
The boiling point of the heat transfer fluid defines the maximal soldering temperature, allowing optimum reflow for lead or lead free solder PCBA reflow. This process is completed regardless of the thermal mass or components used. Allowing for high mix and densely populated PCBA's to be produced, using complex BGA parts.
Advanced Capability with Vacuum Processing Technology:
In the multivacuum soldering process, assemblies are subjected to several vacuum applications with the option of applying vacuum processes both before and during the melting of the solder paste. Applying vacuum processes before the liquidous temperature is reached is particularly useful for removing any voids encapsulated and caused by printing or pick & place processes.
With lead free solders void formation risk is higher, due to the higher process temperatures. The patented technology used on our ASSCON vapour phase removes the voids (formed after soldering) from the liquid soldering location.
Automatic Solder Break (ASB)
During the soldering process, the solder melting is recognised by an automatic recognition of the melting point which avoids effectively the formation of cold soldering locations. The usual engineering of soldering profiles is removed allowing us to produce complex products, with reduced lead times on fast delivery prototypes.
A typical complex PCB assembly produced at Gemini Tec using 0.4 mm pitch/12 mm sq. device: The process used to build this product combines the use solder jet printing, for the application of the solder deposit onto its 0.23 mm pads, placement of device using our Mycronic SX200 chip placement SMT line, followed by vapour phase reflow. Our jet printing capability includes AOI [inspection] of all the deposits, prior to placement, with vapour phase reflow ensuring the PCBA is subjected to correct thermal heat, avoiding interconnection problems, such as short and opens. Vacuum processing capability allows the balls to be free of voids.
Gemini Tec support a wide range of customers and applications from prototype to medium volume production, our investment in processing technology, allows us to support complex and demanding PCBA products where reliability and conformance is essential.
Contact us to talk about your requirements in more detail. +44 (0) 1252 333 444
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