Surface mount PCB production, with high mix & complex capability
Gemini Tec provides a range of production orders and contracts. Our capability is suited to PCBA's using SMT technology with BGA, micro BGA, QFN, DFN, PoP, leadless and complex component parts.
Using Mycronic manufacturing technology we currently place over 5 million components a month, producing batch sizes from 1 to 1000 units. We also produce yearly contracts with volumes up to 10,000 units.
Gemini Tec is the only UK based CEM equipped with two solder jet printers, providing customers with speed and flexibility. Solder jet printing increases the quality of PCBA production and removes all the hidden costs and constraints of SMT assembly.
We operate with five SMT placement machines: Our flagship MY200 'Synergy' line capable of accepting 354 different component types in one set up, making it ideal for PCBA's that contain a high mix of components.
Our SMT lines are fully automated, using board loading and transport conveyors to efficiently process PCBAs through the SMT department. Our automated SMT lines are configured with intelligent Agilis feeders and in-line jet printing and reflow capability, allowing us to optimise the set up and manufacturing times for a variety of batch sizes.
Key elements of our SMT PCB assembly service:
- High mix, low and medium volume orders.
- World-class capability with solder jet printing [MY500 & MY600]
- Automated SMT lines, providing fast and flexible production. [5 lines]
- 7-zone BTU Pyramax reflow ovens. [2 lines]
- Asscon vapour phase reflow, with vacuum processing.
- Mirtec AOI inspection with 5-axis cameras. [3 systems]
- X-Ray, Ersascope, ERSA650 IR rework station.
- Package-on-Package, 0.3 mm BGA assembly.
- Complex SMT capability, BGA, PoP, µBGA, 01005,0201, 0402.
- No clean process & ultrasonic and aqueous cleaning.
- Second stage PTH assembly by IPC technicians.
With our entire SMT process supported with solder jet printing technology, we are able to work with the latest array of component technology and substrates, including flex-rigid, in-board cavity, PoP devices (Package on Package) and devices with small processing windows.
All SMT assemblies are subjected to our technical NPI process, inclusive of any thermal profile verification to ensure product conformance. Our capability also includes vapour phase reflow, using vacuum processing for void free production.
In-process inspection is completed by experienced IPC quality engineers. Gemini Tec use the very latest five camera AOI inspection systems from Mirtec, allowing advanced defect detection. Ersascope cameras and real time X-Ray is also used to assist with product validation.
Second stage PCB assembly is carefully completed by IPC qualified technicians, using manual and automated soldering techniques. Products can be supplied cleaned using ultrasonic and aqueous cleaning, supported with ionic contamination testing. We also have conformal coating capability in-house, using a robotic and selective spraying process.
Full product assembly, box build or mechanical assembly services are conducted along with any functional or validation test services. We use powerful resource planning software to organise and plan our manufacturing workflow and material control.
Our superbly equipped facility has full ESD controls, complete with controlled access and 24 hour CCTV monitoring.
If you are looking to work with an experienced and capable CEM, contact us to arrange a meeting and discuss your requirements in more detail. Tel +44 (0) 1252 333 444
Customer feedback on the service we provide:
"Using Gemini Tec has been a breath of fresh air, delivering product on time and often ahead of planned deliveries to aid DSL in delivering urgent orders to its customers. DSL has historically worked with at least 2 sub-contract manufacturers, but given our confidence in your service and ability we have attained over the years, we have taken the unprecedented move to single source with Gemini"