Gemini Tec have installed and commissioned its second Asscon vapour phase reflow oven, and the UK's first VP2000 fully in-line reflow oven.
Our latest oven has now been added to our MYcronic MY200 Synergy SMT line, along with our MY600 solder jet printer. The investment vastly increases our reflow capacity and capability enabling a wide variety of product volumes to be produced. Our MY200 line is currently fully equipped with NuTek loading and unloading and uses fully automated transport conveyors to deliver bare boards through the entire SMT build process, removing any risk of handling defects.
This latest round of investment provides a fully in-line and automated process for vapour phase reflow, ensuring Gemini Tec remain at the forefront in manufacturing complex PCBA's for its growing customer base and batch sizes.
Gemini Tec initially adopted vapour phase reflow in 2015 and have once again chosen Asscon to provide its latest investment, who were pioneers in this leading edge process and lead the market in vapour phase reflow.
Major benefits of vapor phase reflow:
New to this technology? Read the FAQ's here 'More about vapour phase reflow'
Visit the webpage of ASSCON Systemtechnik-Elektronik GmbH, global leaders in vapor phase reflow.
External resource relating to the benefits of vapor phase for void reduction: https://www.emeraldinsight.com/doi/abs/10.1108/SSMT-10-2017-0031
Gemini Tec have invested into its third Mycronic solder jet printing platform for 2019. Adding the latest Mycronic dual print head MY700 solder jet printer.
Gemini Tec adopted a 100% stencil free process over 11 years ago, being the only UK CEM to offer this technical advantage. The latest MY700 jet printer will further compliment its paste printing platforms of MY500 and MY600, adding further technical capacity to its CEM process capability. Gemini Tec offer a unique service with this mix of process capability, ensuring it can provide true world class capability to its growing customer base.
The latest MY700 is now equipped with dual heads, this allows two paste dispensing heads to be used simultaneously to increase the speed of printing and the mix of solder paste dots. This reduces the cycle time below the average screen printing times, yet still retains more accuracy and repeatabiliy than stencil printing.
New ejectors can now provide smaller 'solder paste dots' when customers are using small and complex devices, such as on 01005 and sub 0.3 mm BGA devices. The ability to reflow smaller dots and ensure conformance is made possible with the use of vapour phase reflow, which is widely available a Gemini Tec with two Asscon vapour phase reflow ovens.
The latest Myrconic MY700 adds more capacity for flexible substrates, LED boards, cavities and package-on-package applications without any technical constraints. The non-contact nozzles that jet solder paste with high precision makes every solder paste deposit perfect, reducing the need for any re-work and increasing production throughput.
The dual-lane option allows for efficient handling of boards and is quipped with a state-of-the art vision system providing fiducial recognition on-the-fly and accurate laser height measurement to automatically compensate for board stretch and warpage that will secure the quality of the dispensing result.