Gemini Tec are fully committed to significant capital investment in world class production capability and have invested in Nitrogen reflow soldering for 2021. This latest investment increases capacity and capability for HDI and ultra complex PCBA production. And with demand increasing for our CEM services, we're delighted to increase support for our customers, including those working within the automotive and aerospace sectors.  

Investment in the latest ERSA Hotflow 4/14 reflow oven from ERSA in Germany will deliver the latest capability to our flagship 'Trilogy' surface mount line, allowing for increased production volumes of complex SMT products, where high reliability is a pre-requisite.

Gemini Tec are pleased to announce its latest expansion plans for 2020, with the addition of a further 10,000 sqft facility. Despite the current wider economic situation, Gemini Tec remain well positioned to expand its service and extend production capability to meet the rise in demand for advanced PCBA manufacturing in the UK. 

This latest move provides a substantial increase in our production footprint, which will house our latest investment in Mycronic SMT equipment, comprising of 2 new SMT machines to create a new 'ultra' high mix surface mount line.

Our latest SMT line has been configured for higher volume and high mix products, complete with fully automatic line loading and fully automatic conveyors. Our latest surface mount line will be using solder jet printing and vapour phase reflow, in keeping with our wider strategy. However N2 reflow technology will also be integrated in Q1/2021.  

The additional space expands our PCB assembly and box build area to undertake a new major contract from our automotive customer and ensure ample room for growth in new business. 

A new operations centre will bring together its commercial, engineering and procurement functions along with a purpose built ESD material kitting and product stocking facility. 

Gemini Tec add the latest Scienscope X-Scope 3000 X-Ray system to its QA department for 2020.

Our latest investment provides additional capability and capacity for PCBA inspection to support our customers production of PCBA's

This latest system is packed with advanced features for the inspection and validation of products. Using a powerful 130kV high power micro power focused closed tube X-Ray source to inspect a wide variety of electronic components beyond BGA & QFN devices, including inner layer PCBs, over moulded connectors, encapsulated connectors, aluminium die castings, wire bonding and semiconductors.

Advanced software tools provide features such as automatic void detection on every electronic component post reflow. Automatic programming now allows us to define the exact devices that require X-ray inspection and subsequently enact the program using the PCBA bar code during the various stages of the production.