Gemini Tec use the very latest processing technology available to manufacture PCBA products. We operate with two Asscon vapour phase reflow ovens, providing customers with seamless PCBA processing from early prototype through to batch production. Gemini Tec are the first UK CEM to operate the latest in-line vapour phase reflow oven, manufactured by Asscon of Germany.
Vapour phase soldering has become the best method to achieve the optimum soldering quality. The development of the in-line process has now reached the suitable point to balance with a fast SMT process. The investment is much greater than convection ovens, so has yet to become mainstream despite many technical benefits.
Read our FAQ's page by clicking this link FAQ's on vapour phase technology.
How does vapour phase work & why is best suited to high technology PCBA products?
Vapour phase is centered around the use of Galden contained within a 'inert atmosphere'. This process is also known as condensation soldering. The process can also be used in conjunction with an applied vacuum to achieve void free soldering on highly complex SMT components.
Within the oven Galden is used as a the heat transfer medium. The fluid is both a non-corrosive and electrically non-conductive and has a maximum operating temperature when in use.
Within the reflow process, fluid starts to evaporate and a layer of vapour and condensing fluid covers the PCBA, creating an inert and oxygen-free atmosphere. The vapour’s weight is greater than the surrounding air and forms a protective gas atmosphere and as soon as the PCBA is immersed into the vapour zone, the vapour condenses on the PCBA and transfers the heat required for reflow.
As the heat transfer is linear across the entire PCBA it will never overheat, irrespective of the time within the vapour. Unlike convection ovens, each portion of the process (i.e. ramp/dwell) can be configured to suit any variable required and the process can be reproduced without deviation.
The vapour phase soldering process achieves the optimum results for a wide range of assemblies, from flexible to multi-layer substrates, with the need to continually create and manage various thermal profiles removed due to even heat distribution across any PCBA.
Advanced Capability with Vacuum Processing Technology
In the multi-vacuum soldering process, assemblies are subjected to several vacuum applications with the option of applying vacuum processes both before and during the melting of the solder paste. Applying vacuum processes before the liquidous temperature is reached is particularly useful for removing any voids encapsulated and caused by the printing or pick & place processes. With lead free solders void formation risk is higher, due to the higher process temperatures. The patented technology used on Asscon vapour phase removes voids (formed after soldering) from the liquid soldering location.
Find out more about market leaders Asscon and vapour phase Technology. https://www.asscon.de/e/index.html
Gemini Tec support a wide range of applications from prototype to medium volume production, our investment in processing technology allows us to build complex and demanding PCBA products where reliability and conformance is essential.
Contact us to talk about your requirements in more detail. +44 (0) 1252 333 444
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