Gemini Tec is a well-respected supplier of technology manufacturing services, with a range of leading edge tools to match. Since the early 1990's G-Tec has been working with surface mount PCBA's and BGA & leadless devices.
Our experience processing PCB assemblies ensures that all products are manufactured correctly during the prototype/NPI phase, with all products checked for conformance using X-ray, optical cameras and AOI. We currently place in excess of 80,000 BGA/PoP devices per year and our experience will ensure any transition into higher technology is both smooth and pain free.
Our SMT assembly plant is configured to manufacture PCB assemblies that use a wide variety of BGA and leadless devices, our comprehensive service covers automated SMT placement, vapour phase reflow capability, including vacuum based vapour phase reflow for void free results.Our expertise is available to support complex electronic PCB assemblies through the complete product lifecycle.
We have a full range of tools in-house to support BGA, PoP & leadless devices:
- Highly experienced IPC trained technicians and engineers.
- Automated & semi automated BGA placement.
- BGA Re-work and device upgrade.
- X-Ray, with 3D real time inspection, ERSAscope optical camera inspection.
- ERSA Infrared BGA re-work station. (Large format capability)
- BGA baking ovens & vacuum sealing, BGA Re-balling. (cold process)
- Package on package BGA assembly, BGA assembly, BGA repair & re-work.
Our experienced IPC technicians can support a broad range of products and components, from BGA's, package-on-package PoP, QFN and technically challenging leadless devices. And with the demand to design and build products using (Package on Package) increasing from hand held products we can build with package-on-package (PoP) technology.
We are the only UK manufacturer to use three state-of-the-art solder jet printers, allowing customers fast and lower cost access to this manufacturing technology. Our Mycronic solder jet printers have Z-height paste control, meaning solder paste deposits can be printed to both PCB’s and ASICC logic dies during the same manufacturing cycle. Our highly flexible chip placers can accurately place stacked memory dies to form the BGA PoP assembly, and we use vacuum based vapour phase reflow for void free production.
We provide a full turnkey service from PCB design to full production, backed with over 40 years of industry experience.
If you are considering the use of complex SMT parts, such as BGA, QFN, PoP (Package-on-Package) please contact us for more assistance. Tel +44 (0) 1252 333 444
Customer feedback on the service we provide:
"Thank you for your efforts in producing this first run of products using the 0.4 mm Package-On-Package device, we are pleased to say we have passed 100% of the batch - and we can now move ahead to production very soon"