Leaders in our Field:
At Gemini Tec we pride ourselves on being pioneers in our field by developing new production methods and adapting quickly to changes in the market. In 2008, we were the first CEM in the UK to adopt solder jet paste printing, a process that accurately and consistently applies solder paste directly to the PCB pad, eliminating the need for stencil tooling. Providing granular level control of all paste typologies removes typical production flaws and allows us to achieve optimum reflow conditions first time and every time.
We are the only CEM in the UK operating exclusively with jet printing technology. We currently have three jet printing systems, including the latest MY700. This latest model has twin printing heads to provide faster cycle times together with small dot capability for sub 0.25mm pad sizes for HDI production.
How does solder jet paste printing work?
Jet printing is a non-contact printing process which applies solder paste directly to the PCB pad, without the need for stencil tooling.
Small solder paste deposits are placed at a rate of over 1 million dots per hour, to accurately construct the optimum solder paste typography for every pad position on the board. Such close control allows us to obtain the optimum reflow conditions first time.
Jet printing removes the limitations of traditional stencils delivering a new level of reliability for rigid and flexible substrates, board cavities, package-on-package, QFNs and new components with small process windows. By optimising the solder paste process we remove the typical production errors, such as floating QFN devices and excessive and insufficient solder, that often lead to poor production yields, higher build costs and unwanted time delays.
The benefits for our customers:
Our investment in the world's foremost process technology ensures our customers benefit from numerous technical and commercial advantages. Our manufacturing process provides high levels of accuracy with consistent quality. Assured delivery times can be achieved without the constraints of using stencils. We adopt a lean, fast and cost-effective approach to SMT/PCB production, regardless of lead-time and PCBA complexity.
We have three Mycronic (MY600JP, MY600JD and MY700) jet printers providing the optimal solder paste deposits at a rate equivalent to 100,000 CPH per SMT line.
- 100% accurate repeatable, without deviation
- Optimum solder joints, typical yields at 100%
- No stencil tooling costs
- Process development in real time
- Lower manufacturing costs
- Shorter lead times and no risk of production delays
- Suitable for all SMT devices, BGA, PoP, QFN devices
- Optimised for 3D cavity printing and technical components
Seamless Tooling & Engineering:
Tooling for our jet printers is created directly from your ODB++ data (or ASCII CAD) using the Aegis Factory Logix front end tool suite. As we no longer need to design and order stencils production is programmed to start immediately.
As the paste tooling is digital, any edits or process improvements can be made in real time, without the need to re-order stencils or compromise quality with excessive re-work. Our process removes potential time delays for raid NPI and provides consistent quality conformance for any batch size produced.
Review our tooling requirements here: G-Tec_Engineering_Data_Packs_Issue_1.pdf
Our passionate teams deliver a world class service, are committed to providing the highest quality products and put our customers at the heart of everything we do. To find out more about our CEM service or arrange a technical demonstration in solder jet printing please contact us on +44 (0) 1252 333 444
What our Customers Think:
"DSL have found the solder jet printing technology used at Gemini has vastly improved the yields for our high complexity PCB products, together with savings in NRE charges and improved delivery times."