Vapour Phase Reflow Soldering for Complex PCB & SMT Electronics
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G-Tec In Line Vapour Phase Soldering for flex, flex-rigid and high thermal mass PCBAsGemini Tec continues to make capital investments to ensure we remain leaders in our field. This world class production equipment allows us to support the assembly and manufacture of a wide variety of PCB products to clients across a range of sectors. 

We use vapour phase reflow soldering to provide superior results for surface mount production. Gemini Tec operate two Asscon vapour phase reflow ovens and were the first UK CEM to adopt this latest generation of in-line capability.

Our Asscon VP2000 in-line vapour phase oven is used in conjunction with our fully automated 'Synergy' SMT line. This particular SMT line is designed to handle a wide range of batch sizes from 2 units to 5000 units per run.

We produce a variety of standard and complex PCB products using cutting edge SMT devices and technology using vapour phase soldering. This process capability enables us to work with an extensive range of standard and advanced materials as well as high thermal mass products.

This reflow technology allows us to seamlessly match processes and achieve a higher level of joint integrity for small and complex SMT components. Our Synergy line provides fast set up and production throughput with superior quality conformance.  


Vapour phase reflow soldering may be a new process to certain customers. Please read our FAQ's in this link FAQ's on vapour phase technology. 

Watch a short video: Here you can see our fully automated vapour phase reflow oven, supported by our Mycronic MY600 solder jet printer together with one of our Synergy SMT placement lines. Our SMT lines are equipped with fully automatic loading/unloading and transportation conveyors to ensure efficiency and optimum quality. 



How does vapour phase reflow soldering work and why do we use it?

Vapour phase is centred around the use of Galden contained within a 'inert atmosphere'. This process is also known as condensation soldering. The process can also be used in conjunction with an applied vacuum to achieve void free soldering on highly complex SMT components.  Within the oven Galden is used as a heat transfer medium. The fluid is both a non-corrosive and electrically non-conductive and has a maximum operating temperature when in use.

Within the reflow process the fluid starts to evaporate and a layer of vapour and condensing fluid covers the PCBA creating an inert and oxygen-free atmosphere. The vapour’s weight is greater than the surrounding air and so forms a protective gas atmosphere. As soon as the PCBA is immersed into the vapour zone, the vapour condenses on the PCBA and transfers the heat required. Only when a full thermal exchange has been completed, will the board be ejected from the reflow oven. In terms of processing PCBA's, products simply wait in a reflow state according to the design type, removing aggressive ramp up temperatures within a short time window.   

As the heat transfer is linear across the entire PCBA it will never overheat, irrespective of the time within the vapour. Unlike convection ovens, each portion of the process (i.e. ramp/dwell) can be configured to suit any variable required and the process can be reproduced without deviation. The need to continually create and manage various thermal profiles is removed, due to the even heat distribution across the entire PCBA. Vapour phase soldering achieves the optimum results for a wide range of PCB assemblies, from flex, flex rigid, heavy copper mass and complex high layer count PCB substrates. 


Advanced PCB Assembly Capability with Vapour Phase with Vacuum Processing TechnologyVapour phase reflow soldering with vacuum at Gemini Tec

In the multi-vacuum soldering process, assemblies are subjected to several vacuum applications with the option of applying vacuum processes both before and during the melting of the solder paste. Applying vacuum processes before the liquidous temperature is reached is particularly useful for removing any voids encapsulated and caused by the printing or pick & place processes. 

With lead free solders void formation risk is higher, due to the higher process temperatures. The patented technology used on Asscon vapour phase equipment removes voids (formed after soldering) from the liquid soldering location. Find out more about market leaders Asscon and vapour phase Technology.

Our passionate teams deliver a world class service, are committed to providing the highest quality products and put our customers at the heart of everything we do. We support our customers with PCBA applications, working from concept to completion starting with the PCB design layout, through to NPI and finally production.

Our investment in processing technology means we can manufacture advanced and demanding PCBA products, where reliability and product conformance are mandatory.

To find out more about our CEM service or arrange a technical demonstration of vapour reflow soldering printing please contact us on +44 (0) 1252 333 444


What our Customers think:

"Sangoma recognizes the high levels of quality and professionalism delivered during the development of our next generation of our products. The quality delivered and the turnaround times were a key element in our products. Sangoma is proud to have you as one of its trusted partners for electronic manufacturing services."