Your assembly undergoes thorough in-house visual 3D AOI inspection at our facility. Conducted by our highly skilled and fully qualified QA Assessment Team this meets the globally recognised IPC standard.
Advanced Process Control and Defect Detection
Regardless of quantity and technology, 3D AOI PCB Inspection is always a standard process for all product manufacturing at Gemini Tec.
Our market leading Mirtec OMNI Vision 3D machines are equipped with world class Moire 3D projector technology and lighting systems for a precise measurement using advanced analysis algorithms.
The system combines 3D, 2D and lateral inspection to build a full picture of each device and accurately identify any failure modes.
3D AOI PCB inspection provides a fully rendered 3D image of the target device including precise analysis of all the physical features, including co-planarity.
These are attained by cross-referencing the physical pad data while simultaneously examining multiple surfaces of each component. This includes inspecting J-Lead and No-Lead components.
Foreign Object Debris (FOD) located outside of the typical inspection area is included within the inspection process for all orders.
Advancements in 3D AOI PCB assembly inspection technology reduce downtime and false errors within the PCBA inspection process.
Tight control parameters are used throughout our manufacturing process to ensure product conformance across all SMT products.
The collection of data and statistics allows us to understand trends and potential defects to avoid failure points ahead of any AOI or test process.
Our ethos and business strategy allows us to focus on product quality above all other KPIs.
Talk to us today about your next project. If you have any queries about 3D AOI PCB Inspection capabilities or to arrange a visit to our industry-leading facility just get in touch.
