Advanced Defect Detection including automatic void detection
Improved efficiency with
Advanced X-Ray Inspection Tools including HDI &
ultra-complex SMT technology
“We are beyond impressed by the attention to detail in your engineering process and addressing errors ahead of production. It’s these critical details that set Gemini Tec apart from other CEMS.” Transportation Sector
In the highly competitive electronics sector, the quality and reliability of your PCBs are of paramount importance. As devices become smaller and more complex, ensuring the integrity of solder joints and other connections is crucial for the optimal performance and longevity of your electronic products.
At Gemini Tec your project undergoes a meticulous quality audit using a robust, well-documented process. We use two different advanced X-Ray inspection platforms to comprehensively examine and measure every aspect of your products. This ensures full conformance and the highest standards of quality and precision in every project we undertake.
Our state-of-the-art X-Ray equipment is capable of automatically measuring the size, volume, and density of every solder joint. This capability allows us to monitor our production process meticulously, ensuring that your product is manufactured to the highest standards.
This covers a broad spectrum of components ranging beyond µBG, QFNs, and leadless devices.
This precisely assesses the barrel fill of PTH components.
This accommodates large-format products up to 575mm x 450m.
This ensures thorough validation while eliminating human error and subjective judgments.
These can be generated, traced by serial number, and are standard in FAIR reports.
Our state-of-the-art X-Ray equipment is capable of automatically measuring the size, volume, and density of every solder joint. This capability allows us to monitor our production process meticulously, ensuring that your product is manufactured to the highest standards.
This serves as a crucial component in the initial reporting process to significantly aid production engineering.
This allows for full inspection.
This enables observation of an extensive array of objects.
This supports sizes up to 580mm x 580mm.
The X-Ray won’t damage the PCB or its components.
Samples don't need to be sent away for analysis and the sample only needs to move through the machine once. This is much faster than solvent testing or visual inspection.
Different images of the same product can be compared to check for any changes made in a production run that might impact quality. Also enables comparisons between products from different manufacturers at different stages in their life cycle.
Talk to us today about your next project, let us know if you have any queries about advanced X-Ray inspection or to arrange a visit to our industry-leading facility: