Removing need for traditional stencil tooling, solder paste jet printing delivers new level of reliability for rigid and flexible substrates, board cavities, package-on-package, QFNs and new components with small process windows.
Ideal for manufacturing of highly complex electronics and PCB products using SMT technology
“We have found the solder jet printing technology used at Gemini has vastly improved the yields for our high complexity PCB productss.” Custom Embedded PCs
Experience unrivalled precision for your PCB products by accessing our suite of systems, featuring the state-of-the-art MY700 equipped with twin printing heads.
This setup guarantees faster cycle times while offering small dot capability, catering to sub 0.2mm pad sizes, perfect for HDI technology production.
By optimising the solder paste process we remove the typical production errors, such as floating QFN devices and excessive and insufficient solder, that often lead to poor production yields, higher build costs and unwanted time delays.
Talk to us today about your next project, let us know if you have any queries or to arrange a visit to our industry-leading facility: